Silicone Encapsulant MCSIL-E160 A/B
RTV2 Silicone Potting Compound for Electronics
Description of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The component A is white and component B is black for easy identification and inspection of complete mixing.(colors can be adjusted as per customer requirement.) When the components are thoroughly mixed in a 1:1 ratio by weight or volume, the liquid mixture cures to a flexible elastomer, which is suited for
electrical/electronic potting and encapsulating applications.
Applications of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
Silicone is a general purpose compound suited for adhesive and coating. This cost-effective silicone can be used in a variety of electronic potting applications including the adhesive and coating for solar power, HID, LCD displayers, circuit board and
electronic components, etc.
Features of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
Silicone compound has a excellent electrical property features in resistant to temperature, corrosion, radiation, insulation, waterproof, damp proofing, shock resistance, thermal conducting, inflaming retarding and weather ability, etc. It can be long-term used under -50℃～200℃.
Typical properties of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
Item No.: MCSIL-E160A/B
Appearance(A/B) White/Grey liquid
Viscosity(A/B,Mpa.s) 3700±2000
Mix ratio (A/B) 1:1
Pot life after curing(25℃,min) 30-40
Curing time (hrs) 2-4
Thermal conductivity(W/m·K)(A/B) ≥0.58
Durometer Hardness(JIS A 0 ) 56
Volume resistivity( Ω·cm ) 7X10 14
Dielectric breakdown voltage(KV/mm) ≥20
Flammability classification UL-94 V-0
Shrinkage % 0.01
Thermal expansion properties of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
The coefficient of thermal expansion ranging of silicone compound is 5.9-7.9 x 10-4/°C. The coefficient of linear thermal expansion is about 1/3 of the coefficient of volume thermal expansion; it can be used for the overall linear thermal expansion calculation of rubber parts under a certain limits of temperature.
Curing time of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
The following cure schedules may be used as a guideline; however, larger masses may
require longer periods of time to reach temperature.
24 hours at 23-25℃
4-6 hours at 50℃
1-2 hours at 100℃
Faster if needed
25-30 mins at 60℃
18 mins at 70℃
5 mins at 80℃
Using Instructions of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
Silicone compound part A and Part B should be thoroughly mixed at a 1:1 ratio (weight or volume) before using. Pour into the electronic components after vacuum de-airing. Silicone compound may be cured at room temperature or accelerated with heat.
Precautionsof RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
1. The curing time varies due to different temperature, the higher temperature, it cures faster. Users can adjust the ratio of catalyst according to the temperature in order to get an ideal curing speed.
2. Certain materials can inhibit the cure of Silicone rubber. The most notable include: sulfur, polysulfide, sulfur-containing material, Organ tin and organ metallic compound, etc.
3. Prevent from contact with tin, phosphorus, water, ammonium, chlorine, carboxylic acid, hydroxyl compound, etc. to avoid un-curing circumstance.
Packing and Storage of RTV 2 Silicone Potting Compound Silicone Encapsulant For Electronic Components MCSIL-E160
1. Silicone rubber is shipped as kits that Part A and B liquid components in separate containers. It is available in packing in 5kg or 20kg per pail.
2. Silicone rubber must be tightly sealed in cool and dry place, prevented from sun and rain. Transport by non-dangerous goods.
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